Formation mechanism and organizational controlling of ultra-fine-grain copper processed by asymmetrical accumulative rolling-bond and annealing  被引量:2

异步叠轧辅助退火制备超细晶铜材的形成机制及组织控制(英文)

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作  者:王军丽[1,2] 徐瑞东[3] 王绍华[1] 钱天才[1] 史庆南[2] 

机构地区:[1]昆明理工大学分析测试研究中心,昆明650093 [2]昆明理工大学稀贵及有色金属先进材料教育部重点实验室,昆明650093 [3]昆明理工大学冶金与能源工程学院,昆明650093

出  处:《Transactions of Nonferrous Metals Society of China》2012年第11期2672-2678,共7页中国有色金属学报(英文版)

基  金:Project (50804018) supported by the National Natural Science Foundation of China;Project (ZDS2010015C) supported by Key Lab of Advanced Materials in Rare and Precious and Non-ferrous Metals, Ministry of Education, KMUST, China;Project (2010DH025) supported by Yunnan Province Construction Plans of Scientific and Technological Conditions, China

摘  要:The initial copper with large grain sizes of 60-100 μm was processed by six passes asymmetrical accumulative rolling-bond (AARB) and annealing, the ultra-fine-grained (UFG) copper with grain size of 200 nm was obtained, and the microstructures and properties were studied. The results show that there are large sub-structures and also texture component C for the UFG copper obtained by six passes AARB, possessing high strength and microhardness in company with poor elongation and conductivity. Thereafter, the UFG copper was annealed at 220 °C for 35 min, in which the sub-structures disappear, the grain boundaries are composed of big angle grain boundaries, and the textures are composed of a variety of texture components and parts of twins. Compared with the UFG copper obtained by six passes AARB, the tensile strength and yield strength for the UFG copper obtained by six passes AARB and annealing at 220 °C for 35 min are decreased slightly, the elongation and conductivity are improved obviously.对原始晶粒大小为60~100μm的铜材进行六道次大变形异步叠轧并辅助退火处理,获得晶粒大小为200nm的超细晶铜材,研究超细晶铜材的微观组织结构和性能。结果表明:六道次大变形异步叠轧后的超细晶铜材组织中存在大量的亚结构,也存在特定织构C组分,其强度和显微硬度高但伸长率和电导性下降。经220°C、35min退火处理后,亚结构消失,晶界由大角度晶界组成,织构由多种织构组分组成,也出现部分孪晶。与六道次大变形异步叠轧的超细晶铜材相比,经220°C、35min退火处理的超细晶铜材的抗拉强度和屈服强度略有下降,但伸长率和导电性明显提高。

关 键 词:ultra-fine-grain copper asymmetrical accumulative rolling-bond ANNEALING formation mechanism organizational controlling elongation conductivity 

分 类 号:TG156.2[金属学及工艺—热处理]

 

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