环氧结构胶固化工艺对胶接接头性能的影响  

Effect of curing process of epoxy structural adhesive on performance of adhesive bonded joints

作　　者：徐喻琼[1] 游敏[1] 梅春枝[1] 

机构地区：[1]三峡大学机械与材料学院,湖北宜昌443002

出　　处：《粘接》2012年第12期42-45,共4页Adhesion

基　　金：湖北省教育厅科学技术研究项目(编号Q2012307)

摘　　要：以XH-11环氧结构胶为研究对象,采用正交试验法进行多因素试验设计,研究了固化温度、固化时间、晾置时间、表面粗糙度等因素对金属胶接接头拉伸剪切强度和冲击强度的影响,得出了最佳固化条件,并通过数据统计分析得到影响因素为自变量的力学性能回归方程,为胶接接头的强度预测提供参考。The paper studied the influence factors on the performance of metal adhesive joints,such as curing temperature,curing time,open assembly time and surface roughness.The orthogonal experiment method was adopted to determine the optimal curing condition of XH-11 epoxy structural adhesive for tension load and impact toughness.The optimal cure conditions were obtained through the data statistical analysis.The independent variable regression equations were deduced when the influence factors are taken into account.The formulas can provide the reference of the prediction of the strength of adhesive bonded joints.

关 键 词：结构胶 固化工艺 胶接接头 

分 类 号：TQ433.437[化学工程]