Sn-纳米SiC复合电镀工艺对电流效率的影响  

Effect of Composite Electrodeposition Process on Current Efficiency of Sn-SiC Coating

作　　者：初红涛[1,2] 赵悦[2] 苏立强[2] 安茂忠[1] 

机构地区：[1]哈尔滨工业大学化工学院,黑龙江哈尔滨150001 [2]齐齐哈尔大学化学与化学工程学院,黑龙江齐齐哈尔161006

出　　处：《热加工工艺》2012年第24期195-197,共3页Hot Working Technology

基　　金：国家自然科学基金资助项目(50774025);齐齐哈尔市工业攻关项目(GYGG2010-06-1);齐齐哈尔大学青年教师科研项目(2010k-M17);黑龙江省教育厅科研项目(12521607)

摘　　要：研究了Sn-SiC纳米复合电沉积工艺,考察了主盐浓度、甲磺酸浓度、电流密度、温度等因素对电流效率的影响规律。结果表明,当Sn2+浓度为0.18～0.24 mol/L、甲磺酸浓度为60～120 g/L、电流密度为1～3 A/dm2、温度为20～30℃时,电沉积过程中具有较高的电流效率。A Sn-SiC nano-composite electrodeposition behavior was studied. The cvxrent efficiency of plating solution was tested during electrodeposition process. The electrodeposition behavior were investigated by the concentration of main salt, the concentration of methylsulfonic acid, current density, temperature and other factors. The results show that, when the concentration of Sn2＋ is 0.18-0.24 mol/L, the concentration of methylsulfonic acid is 60-120 g/L, current density is 1-3 A/din2 and the temperature is 20-30 C, there is a higher current efficiency in the electrodeposition process.

关 键 词：甲磺酸 锡 纳米SIC 复合电沉积 电流效率 

分 类 号：TG174[金属学及工艺—金属表面处理]