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作 者:潘京生[1,2] 徐伟[1] 郑涛[2] 张正君[1] 孙建宁[1] 吕景文[2]
机构地区:[1]北方夜视技术股份有限公司南京分公司,南京211102 [2]长春理工大学材料科学和工程学院,长春120022
出 处:《真空科学与技术学报》2012年第12期1103-1108,共6页Chinese Journal of Vacuum Science and Technology
基 金:预研项目40405030202
摘 要:将微通道阵列移植到体导电基体可使微通道板(Microchannel Plate,MCP)免受离子反馈难题的困绕,而半导体玻璃可在不改变MCP的传统制作方法的基础上制作体导电MCP。一种特定组分的钒铁铅铝磷酸盐的半导体玻璃,采用与传统的还原铅硅酸盐玻璃MCP完全相同的制作方法,但不经过氢还原处理,制作成通道间距为12μm的25 mm直径的无实体边的MCP样品,这种半导体玻璃制作的MCP样品,在加载1 kV的恒稳态电压下,有稳定的微安级的传导电流和102量级的电流增益。本文对这种钒铁铅铝磷酸盐的半导体玻璃及其制作的体导电MCP样品的基本性能和表现进行了表征和分析,并讨论了进一步改进措施。We addressed the fabrication of bulk conductive micro-channel plate(MCP)with a novel type of semi- conductive glass. Extending microchannel matrix to abulk conductive substrate was considered to be an effective approach to avoid the disturbance of ion feedback problem in MCP. The newly-developed semiconductive glass was made of a spe- cial composition of vanadium iron lead aluminum phosphate. A 25 mm diameter rimless MCP with 12μm pore pitch, was fabricated in the same way that the reduced lead silicate glass MCP was fabricated, but without the hydrogen reduction processing. The measured results show a steady conductive current of several microamperes and a current gain of 102 were obtained when a 1 kV bias voltage applied.
分 类 号:TN223[电子电信—物理电子学]
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