某机载电子设备热设计  

Thermal design of certain airborne electronic equipment

作　　者：张娅妮 胡清 

机构地区：[1]中国航空计算技术研究所,陕西西安710119

出　　处：《现代电子技术》2013年第3期151-153,157,共4页Modern Electronics Technique

基　　金：航空科学基金(20100231)

摘　　要：为了提高机载电子设备的冷却散热性能,保证设备可靠稳定工作,采用热仿真方法,对某机载电子设备进行了热设计。根据设备结构特点,提出了多种不同的设计方案,并对其进行了对比分析。综合考虑设备散热效果及可维修性,确定了最优的设计方案,实现了对某机载电子设备的热设计。该热设计方案已随电气设计和结构设计一起通过了各项验证试验,使用情况良好,同时,也为同类型机载电子设备热设计提供了较大的参考价值。Thermal design of certain airborne electronic equipment was carried out by thermal simulation method in order to improve the cooling performance and working stabilization. According to features of equipment structures, the paper presented various design schemes and made a comparative analysis of them. The optimal structure design scheme was determined to achieve the thermal design of certain airborne electronic equipment through the overall consideration of thermal dissipation ef- fects and maintainability. The thermal design along with electrical design and structure design have passed several verification tests and at the same time provided great reference for the same types of airborne electronic equipments.

关 键 词：机载 电子设备 热设计 热仿真 

分 类 号：TN806.34[电子电信—信息与通信工程]