系统级芯片动态温度响应快速估计方法研究  

System Level Dynamic Temperature Estimation for SOC

作　　者：黄旻忞[1] 杨宏来[1] 

机构地区：[1]同济大学电子信息工程学院,上海201804

出　　处：《计算机科学》2013年第1期26-28,53,共4页Computer Science

摘　　要：针对高性能集成芯片的热管理,提出了一种动态温度的快速估计方法。该估计方法利用等价热阻网络建立芯片热电模型,在实时电路中把芯片由于外部激励和自生耗能引起的温度变化反馈到估计过程中,并采用数字滤波原理,将连续时域响应函数转化为离散时域响应函数,通过温度-功耗迭代计算可以准确高效地估计动态电路的温度变化。通过C语言程序实现了该温度估计算法,并通过实验验证了该方法能够有效地提高实时温度响应估计的准确度和实时性,适用于系统级芯片动态温度管理。Increase of non-uniform power density and high switching frequency has presented new challenges in predicting transient temperature response to fast-changing power inputs in highly integrated circuit.This work presented a fast algorithm for predicting temperature evolution of a System on Chip（SoC） or more general semiconductor devices.It utilizes the equivalent thermal RC network for model reductions,and adopts recursive infinite impulse response（IIR） digital filters for accelerated computation in discrete time-domain.The algorithm is validated by comparison to existing convolution integral methods,yielding excellent agreement with several orders of magnitude improvement in computation efficiency.Due to its simplicity in implementation,the algorithm is very suitable for run-time evaluation of temperature response for dynamic power management applications.

关 键 词：动态热管理 等效热电模型 动态温度时域响应 

分 类 号：TP211[自动化与计算机技术—检测技术与自动化装置] TP331.11[自动化与计算机技术—控制科学与工程]