电极施加方式对纯铜凝固组织的影响  

Effect of Ways of Electrodes on Pure Copper Solidification Structure

作　　者：陈克全[1] 王海川[1] 钱章秀[1] 谢文娟[1] 陈鹏飞[1] 

机构地区：[1]安徽工业大学冶金与资源学院,安徽马鞍山243002

出　　处：《安徽工业大学学报（自然科学版）》2013年第1期11-15,共5页Journal of Anhui University of Technology（Natural Science）

基　　金：国家自然科学基金项目(50774108);安徽工业大学研究生创新研究基金项目(2011001)

摘　　要：以纯铜为原料,通过改变电极方式及同一电极施加方式下脉冲电压的大小,来研究电极施加方式对纯铜凝固组织的影响。结果表明:电极式侧插时,纯铜晶粒细化效果最明显,石墨坩埚式电极细化效果次之,平行式电极细化效果最差,但平行电极处理后纯铜平均晶粒面积仍比未施加电场时小;3种电极施加方式下,最佳晶粒细化效果的脉冲电压存在最佳值,本实验中为3 V,其中电极式侧插时晶粒细化效果最好,平均晶粒面积为0.11 cm2。The effect of different ways of electrodes of pulse electric field on solidification structure of pure copper by changing the ways of electrodes and the voltage of the pulse electric filed was studied. The experimental results show that the best grain refinement of pure copper is the electrode side inserted, the electrode graphite crucible is next and the parallel electrode is last, the grain size of pure copper treated with the parallel electrode is still lower than the pure copper which not treated by the pulse electric filed. The best rain refinement of pure copper exists with the best voltage of which 3 V is applied in this experiment and the best grain size is 0.11 cm2.

关 键 词：电极施加方式 纯铜 凝固组织 

分 类 号：TG113[金属学及工艺—物理冶金]