SiC_p/Al复合材料化学镀镍-磷的工艺研究  

A Study of Electroless Ni-P Plating on SiC_p/Al Composite Material

作　　者：尹明勇[1] 马立群[1] 王娟[1] 金荣荣[1] 丁毅[1] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《电镀与环保》2013年第1期27-29,共3页Electroplating & Pollution Control

摘　　要：采用钯盐对SiCp/Al复合材料表面进行活化,化学镀后在复合材料表面获得Ni-P镀层。利用扫描电镜(SEM)、能谱成分分析仪(EDS)、极化曲线、X射线衍射仪(XRD)以及热震测试等手段对镀层的性能进行了研究,并观察了镀覆过程中镀层表面形貌的变化。结果表明:钯盐的活化作用较好,钯原子优先在复合材料的基体晶界、SiCp/Al界面及SiCp表面粗糙处形成催化活化中心;铝合金基体与SiCp增强相表面均被镀覆,且镀层光亮、致密、连续,耐蚀性好,结合力高,属于中磷镀层。A Ni-P coating was obtained on the surface of SiCp/A1 composite material after Pd activation and electroplating. The properties of the coating were investigated by means of SEM, EDS, polarization curve, XRD, thermal shock test, etc. , and the changes of the coating surface morphology during plating were also observed. The results show that the composite material is well activated by Pd, Pd atoms preferentially forming a catalytic and active centre in the grain boundary of aluminum alloy matrix, SiCp/A1 interface and rough area of SiCp surface. Both the surfaces of aluminum alloy matrix and SiCp reinforcing phase are covered. And the coating is bright, compact and continuous, with a good corrosion resistance and a high binding force, belonging to medium phosphorous coating.

关 键 词：SICP/AL复合材料 化学镀 钯 NI-P镀层 耐蚀性 

分 类 号：TQ153[化学工程—电化学工业]