(YCa)F_3助烧AIN陶瓷的显微结构和热导率  

Microstructure and Thermal Conductivity of Aluminium Nitride with (YCa)F_3 as Sintering Aid

作　　者：刘耀诚[1] 周和平[1] 乔梁[1] 

机构地区：[1]清华大学材料科学与工程系新型陶瓷与精细工艺国家重点实验室,北京100084

出　　处：《无机材料学报》2000年第4期619-624,共6页Journal of Inorganic Materials

摘　　要：采用（ＣａＹ）Ｆ_３为助烧结剂，低温烧结（１６５０℃， ６ｈ）制备出热导率为２０８Ｗ／ｍ·Ｋ的ＡＩＮ陶瓷，在烧结过程中，热导率随保温时间的变化服从方程：λ（ｔ）＝λ∞－△λ（０）·ｅ^（－ｔ／ｒ）·用ＳＥＭ、 ＳＴｈＭ、 ＴＥＭ和 ＨＲＥＭ对 ＡＩＮ陶瓷的显微结构及其对热导率的影响进行了研究，结果表明，晶粒尺寸对ＡＩＮ陶瓷热导率的影响可以忽略，而分隔在ＡＩＮ晶粒之间的晶界相会降低热导率。Aluminium nitride ceramics were successfully fabricated through low-temperature sintering by using (YCa)F_3 as the sintering aid. AIN ceramics with a high thermal conductivity of 208W/m·K were obtained after the specimen was sintered at 1650℃ for 6h. Calculation based on the present and reported results led to an equation which describes the dependence of thermal conductivity of AIN on the soaking time in sintering: λ(t) =λ∞ -△λ(0)·e^(t/r). SEM, TEM, SThM and HREM were employed to study, the microstructure-property relationship of AIN ceramics. It was concluded that AIN grain sizes have little effect on the thermal conductivity, while grain boundary phases deteriorate thermal conductivity.

关 键 词：烧结 显微结构 氮化铝陶瓷 助烧结剂 热导率 

分 类 号：TQ174.758[化学工程—陶瓷工业]