烧成工艺对低压用BaTiO_3基PTCR陶瓷性能的影响  

Influences of Sintering Process on the Properties of BaTiO_3-based PTCR Ceramics

作　　者：汪伟[1] 沈春英[1] 丘泰[1] 

机构地区：[1]南京工业大学材料科学与工程学院,南京210009

出　　处：《人工晶体学报》2013年第1期84-87,共4页Journal of Synthetic Crystals

基　　金：长江学者和创新团队发展计划(IRT1146);江苏高校优势学科建设工程资助项目

摘　　要：采用固相反应法制备低压用BaTiO3基PTCR陶瓷。采用XRD、SEM分析陶瓷的相组成及表面形貌。研究了烧成工艺对陶瓷性能的影响。当烧成温度为1280℃,降温时低温保温温度为1045℃时,制备出低阻高耐压BaTiO3基PTCR陶瓷,其室温电阻率ρRT为36Ω·cm,温度系数α为13.8%/℃,耐电压强度E为100 V/mm。BaTiO3-based PTCR ceramics were prepared by solid state reaction method. The phase composition and microstructure of the ceramics were investigated by XRD and SEM. The effects of sintering process on the properties of the ceramics were investigated. When sintering temperature is 1280 ℃, during the cooling process, soaking temperature is 1045 ℃, the room-temperature resistivity of the ceramic is 36Ω· cm, temperature coefficient of resistance is 13.8%PC, withstand voltage strength is 100 V/mm.

关 键 词：BATIO3 PTCR陶瓷 烧成工艺 电性能 

分 类 号：TQ174[化学工程—陶瓷工业]