颗粒增强复合材料相界面的动态应力分析  

Dynamic Stress Analysis of the Interface in a Particle-Reinforced Composite

作　　者：陈建康 黄筑平[3] 白树林 

机构地区：[1]非线性连续介质力学国家重点实验室 [2]扬州大学水利与建筑工程学院,扬州225009 [3]扬州大学水利与建筑工程学院 [4]北京大学力学与工程科学系

出　　处：《应用数学和力学》2000年第7期679-685,共7页Applied Mathematics and Mechanics

基　　金：国家自然科学基金!资助重点项目和面上项目 (196 32 0 30 ;19872 0 0 8);扬州大学自然科学基金

摘　　要：针对硬微粒填充高聚物复合材料因相界面脱粘开裂生成微孔洞的微损伤成核机制 ,取材料的代表体积单元进行动力分析 ,通过对粘弹性基体本构关系作Laplace变换建立了基本方程 ,并引入Hankel变换 ,得到了球对称动荷载作用下相界面应力变化规律的解析解 ,据此分析了惯性效应和粘性效应对界面脱粘的影响·The analysis of the dynamic stress on the particle_matrix interface in particle_reinforced composite for the reason that this stress may lead to the microvoids' nucleation due to the interfacial debonding were studied. For simplification, the representative volume element (RVE) was taken as an analysis model. The Laplace transformation was used to derive the basic equations, and the analytical solutions were obtained by means of Hankel transformation. Moreover, the influences of the inertia and viscosity on the debonding damage were also discussed.

关 键 词：动态应力 微孔洞成核 相界面 颗粒增强复合材料 

分 类 号：TB330.1[一般工业技术—材料科学与工程]