电子浆料银包铜微粉的制备、表征及性能研究  

Preparation,characterization and performance of micro silver-coated copper powders in Electronic Paste

作　　者：李雅丽[1] 付新[1] 刘娟[1] 

机构地区：[1]渭南师范学院化学与生命科学学院,渭南714000

出　　处：《化工新型材料》2013年第1期112-114,共3页New Chemical Materials

基　　金：陕西省自然科学基金项目(2011JM6005);渭南市自然科学基础研究计划项目(2012JCYJ-4)

摘　　要：以CuSO4.5H2O、AgNO3为原料,采用葡萄糖预还原法-直接置换法制备银包铜微粉。用X射线衍射仪(XRD)、动态光散射粒径测试仪和热重仪对粉体进行表征。通过对照实验,分析了粉体导电性、抗氧化性及粒径大小和分布的影响因素。实验表明:在乙二醇介质中通过葡萄糖预还原,采用直接置换法,以甲醛为还原剂,控制甲醛与铜物质的量之比为3∶1,银与铜物质的量之比为2∶1,可得到抗氧化性、导电性良好的银包铜微粉。The micro size silver-coated copper powders were prepared by pre-reducti0n method and replacement re- action with CuSO4.5H20,AgNOa as raw materials. The powders were characterized by XRD, DLS and TG. The influence factors of conductivity, antioxidativity and its particle size were analysed through contrast experiment. The results showed that silver-coated copper powders were prepared by direct replacement, in which the formaldehyde was employed as the re- ducing agent. The mole ratio of formaldehyde and copper, copper and silver was 3：1 and 2：1, respectively. Silver-coated copper powders exhibited good conductivity and antioxidativity.

关 键 词：预还原法 置换法 银包铜粉 电子浆料 

分 类 号：TF123.2[冶金工程—粉末冶金]