退火温度对Bi_(3.15)(Eu_(0.7)Nd_(0.15))Ti_3O_(12)铁电薄膜力学性能的影响  

Effect of Annealing Temperature on the Mechanical Properties of Bi_(3.15)(Eu_(0.7)Nd_(0.15))Ti_3O_(12) Ferroelectric Thin Films

作　　者：蒋大洞[1] 郑学军[1] 龚跃球[1] 朱哲[1] 彭金峰[1] 

机构地区：[1]湘潭大学材料与光电物理学院,湘潭411105

出　　处：《无机材料学报》2013年第2期131-135,共5页Journal of Inorganic Materials

基　　金：教育部长江学者和创新团队发展计划([2011]20);国家自然科学基金(10825209);长江学者奖励计划([2009]17);湘潭大学博士科研启动基金(11QDZ24)~~

摘　　要：利用金属有机物分解法(MOD)在Pt/Ti/SiO2/Si(111)衬底上制备了Bi3.15(Eu0.7Nd0.15)Ti3O12(BENT)薄膜,并经600℃、650℃、700℃、750℃退火处理。通过纳米压痕法测试了薄膜的硬度和弹性模量,采用X射线衍射(XRD)测量了薄膜的残余应力。BENT薄膜的晶粒尺寸随着退火温度的升高而不断变大。当晶粒尺寸从37 nm增大到46 nm时,薄膜的硬度值从8.4 GPa减少到3.1 GPa,弹性模量从171.5 GPa减小到141.6 GPa。随着退火温度从600℃升高到750℃时,薄膜的残余压应力值从–743 MPa减小到了–530 MPa。退火温度为600℃的BENT薄膜具有最大的硬度和弹性模量。Bi3.15（Eu0.7Nd0.15）Ti3012 （BENT） thin films were deposited on Pt/Ti/SiO2/Si（lll） substrates via metal- organic decomposition （MOD） and annealed at 600℃, 650℃, 700℃ and 750℃. The hardness and elastic modulus were measured by nanoindentation, and the residual stress was measured by X-ray diffraction （XRD）. The grain sizes of the BENT thin films increase with the annealing temperatures increasing. With the grain size increasing from 37 nm to 46 nm, the hardness decreases from 8.4 GPa to 3.1 GPa and the elastic modulus decreases from 171.5 GPa to 141.6 GPa. While the annealing temperature increases from 600℃ to 750℃, the residual stress decreases from -743 MPa to -530 MPa. The BENT thin film annealed at 600℃ shows the largest hardness and elastic modulus.

关 键 词：弹性模量 硬度 残余应力 退火温度 

分 类 号：TQ174[化学工程—陶瓷工业]