功耗芯片散热器辐射计算和屏蔽结构设计  

Calculation of Power Chip Heat-sink Radiation and Design of the Shielding Structure

作　　者：安静[1,2] 祝良荣[1] 郑红峰[1] 吴雄喜[1] 

机构地区：[1]浙江工业职业技术学院机电工程分院,绍兴312000 [2]中国科学院长春光学精密机械与物理研究所应用光学国家重点实验室,长春130033

出　　处：《微波学报》2013年第1期93-96,共4页Journal of Microwaves

基　　金：中国科学院"十一五"支撑技术研究项目;浙江省教育厅科研资助项目(Y201122496)

摘　　要：减少功耗芯片散热器的辐射是PCB板电磁兼容设计必须解决的问题之一。文中建立了铝制带鳍散热器物理模型,应用有限元法分析了芯片与散热器间能量耦合机理,鳍叶走向、激励源施加方向的改变对散热器辐射方向的影响,研究了屏蔽板最佳尺寸、放置位置对辐射的抑制效果。计算结果表明:制约散热器主辐射方向的是激励源施加方向,与鳍叶走向无关。正确放置的屏蔽板越长,放置位置离散热器越近,对辐射抑制越有利;屏蔽板理想高度是与散热器等高:散热器辐射强度与屏蔽板厚度无线性关系,取值与鳍叶等厚是合理选择。Reducing the power chip heat-sink radiation is one of the key issues for the PCB electromagnetic compati- bility design. In this paper, the physical model of aluminum heat-sink with fins is established. The energy coupling mecha- nism between the heat-sink and chip is analyzed by means of the lqnite element method. The influence of the fin lobe direc- tion, excitation source direction on the heat-sink radiation direction are also analyzed. The suppression effect of shield plate optimum size and position on the radiation are discussed. It is shown that the restriction for heat-sink main radiation direction are the direction of the excitation source, regardless of the fin lobe direction. If the shield plate is placed correctly, the lon- ger the shield plate, the closer the heat-sink, and the better the radiation suppression effect. The ideal height is equal to the height of the heat-sink. There is no linear relationship between the heat-sink radiation and the shield plate thickness. The value is equal to the thickness of the heat-sink fin is a reasonable choice.

关 键 词：带鳍散热器 屏蔽板 辐射 有限元法 电路板 

分 类 号：TN41[电子电信—微电子学与固体电子学] TN03