硅/玻璃基板互连和无源元件的动向  

Trends of interposers and passive devices by Si/Glass base substrates

作　　者：蔡积庆(译) 

机构地区：[1]江苏南京,210018

出　　处：《印制电路信息》2013年第2期53-58,共6页Printed Circuit Information

摘　　要：概述了硅玻璃互连板和硅系集成无源元件(IPD)的动向。无源元件制造商的PCB嵌入用硅系芯片元件已经问世。硅基板上的微细薄膜线路和薄膜元件实现无硅化。This paper describes the trend of Si/glass base interposer and Si base integrated passive device（IPD）. Si base chip devices for PCB embedded with passive component has been in practice. Fine film wiring and fine film devices on Si base Substrates are realized silicon free.

关 键 词：硅玻璃互连板 集成无源元件(IPD) Si系芯片元件 无Si化 

分 类 号：TN41[电子电信—微电子学与固体电子学]