MEMS低温圆片级键合密封工艺研究  

Study on MEMS Low Temperature Wafer Level Adhesive Bonding Process

作　　者：葛羽屏[1] 

机构地区：[1]上海电子信息职业技术学院电子工程系,上海201411

出　　处：《压电与声光》2013年第1期105-107,共3页Piezoelectrics & Acoustooptics

摘　　要：研究了一种使用非光敏苯并环丁烯(BCB)材料的低温硅片级键合,并将其用于压力谐振传感器封装。采用AP3000作为BCB中的黏结促进剂,将谐振片与硅片或Pyrex 7740玻璃晶圆键合,程序简单,低成本,密封性能较高,且键合温度低于250℃。通过拉伸实验,这种键合的剪切强度高于40MPa。所以此硅片级键合适用于压力传感器的封装。The low temperature wafer level bonding process with non-photosensitive BCB was introduced in this paper,and this process can be used for the resonant pressure sensor package. Using the AP3000 as the BCB bond accelerators,the resonant piece was bond with silicon or Pyrex 7740 glass wafer. The bonding technology prevails for its simple procedure,low cost, high hermetic quality and bonding temperature of lower than 250 ℃. The tensile tests show that the shear strength of the bonding is more than 40 MPa. The wafer level bonding process is suitable for resonant pressure sensor package.

关 键 词：苯并环丁烯(BCB) 键合 谐振器 压力传感器 微机电系统(MEMS) 圆片级封装(WLP) 密封 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]