Thermoelastic stress analysis of multilayered films in a micro-thermoelectric cooling device  

作　　者：Yu-Mei Yang Xing-Zhe Wang Wen-Jie Zhang 

机构地区：[1]Key Laboratory of Mechanics on Environment and Disaster in Western China, The Ministry of Education of China, College of Civil Engineering and Mechanics, Lanzhou University

出　　处：《Acta Mechanica Sinica》2012年第6期1644-1650,共7页力学学报（英文版）

基　　金：supported by the National Basic Research Program of China(2007CB607506);the Fok Ying-Tong Education Foundation for Young Teachers in the Higher Education Institutions of China(111005);the Foundation for Innovative Research Groups of the National Natural Science Foundation of China(11121202)

摘　　要：This paper presents an analytical solution for the thermoelastic stress in a typical in-plane＇s thin-film micro- thermoelectric cooling device under different operating con- ditions. The distributions of the permissible temperature fields in multilayered thin-films are analytically obtained, and the characteristics, including maximum temperature dif- ference and maximum refrigerating output of the thermo- electric device, are discussed for two operating conditions. Analytical expressions of the thermoelastic stresses in the layered thermoelectric thin-films induced by the tempera- ture difference are formulated based on the theory of mul- tilayer system. The results demonstrate that, the geometric dimension is a significant factor which remarkably affects the thermoelastic stresses. The stress distributions in layers of semiconductor thermoelements, insulating and support- ing membrane show distinctly different features. The present work may profitably guide the optimization design of high- efficiency micro-thermoelectric cooling devices.This paper presents an analytical solution for the thermoelastic stress in a typical in-plane＇s thin-film micro- thermoelectric cooling device under different operating con- ditions. The distributions of the permissible temperature fields in multilayered thin-films are analytically obtained, and the characteristics, including maximum temperature dif- ference and maximum refrigerating output of the thermo- electric device, are discussed for two operating conditions. Analytical expressions of the thermoelastic stresses in the layered thermoelectric thin-films induced by the tempera- ture difference are formulated based on the theory of mul- tilayer system. The results demonstrate that, the geometric dimension is a significant factor which remarkably affects the thermoelastic stresses. The stress distributions in layers of semiconductor thermoelements, insulating and support- ing membrane show distinctly different features. The present work may profitably guide the optimization design of high- efficiency micro-thermoelectric cooling devices.

关 键 词：Thermoelectric cooling device Multilayeredthin-film Thermoelastic stress - Analytical solution 

分 类 号：O343.6[理学—固体力学]