环氧树脂/微粉化双氰胺复合材料制备与性能研究  

Study on Preparation and Properties of Epoxy/Resin Micronized-dicyandiamide Composite

作　　者：郝壮[1] 宁荣昌[1] 明璐[1] 杨卫朋[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710129

出　　处：《中国塑料》2013年第2期30-33,共4页China Plastics

摘　　要：采用微粉化处理过的双氰胺固化环氧树脂,自制FH-1作为促进剂制备出一种可中温固化、具有一定潜伏性的环氧树脂固化体系,通过偏光显微镜对比微粉化前后双氰胺在环氧中的分散状态。结果表明,微粉化双氰胺在环氧树脂中均匀分散且不会沉淀,贮存期可达3个月以上。自制FH-1促进剂使得固化反应温度下降40～50℃。浇注体冲击强度为56.3kJ/m2,拉伸强度为91.4MPa,断裂伸长率为4.6%,固化体系具有较高的韧性。单向玻纤增强复合材料湿态保持率在70%以上,树脂与纤维浸润性优异。A latent and medium-temperature cured epoxy resin system was prepared from epoxy/ micronized-dicyandiamide/FH-1. Polarizing microscope revealed that the micronized dicyandiamide could be well-distributed and kept stable in epoxy. The initial curing temperature was decreased about 40～ 50℃ compared with that based on non-micronized-dicyandiamide. The optimal mechanical properties of the resin were flexural strength 56.3 kJ/m^2, tensile strength 91.4 MPa, elongation at break 4. 6%. For the composites reinforced with fiber-glass, the retention rate of mechanical properties at wetting condition was over 70%.

关 键 词：微粉化双氰胺 预浸料 韧性 湿热性能 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]