Cu-Ni-Ti非晶钎料钎焊Si3N4陶瓷的界面结构及连接强度  

Interfacial Microstructure and Bonding Strength of Si3N4 Ceramic Brazed with Cu-Ni-Ti Amorphous Filler Metal

作　　者：邓振华[1,2] 易耀勇[2] 房卫萍[2] 卢斌[1] 

机构地区：[1]中南大学材料科学与工程学院,湖南长沙410083 [2]广州有色金属研究院焊接技术研究所,广东广州510650

出　　处：《热加工工艺》2013年第5期175-178,共4页Hot Working Technology

基　　金：广东省高新技术产业化项目-工业攻关(2010B010800037)

摘　　要：采用Cu-Ni-Ti非晶钎料钎焊Si3N4陶瓷,利用SEM、EDS等分析手段研究了其钎焊界面的微观结构。结果表明:反应层由两部分组成,其中紧靠Si3N4陶瓷的反应层Ⅰ由TiN化合物组成,Ti-Si化合物构成了反应层Ⅱ。在1100℃×10 min下钎焊时,其接头强度有最大值284.6 MPa。在相同的钎焊工艺条件下,非晶钎料接头强度高于同成分晶态钎料。Si3N4 ceramic was brazed with Cu-Ni-Ti amorphous filler metal. The interracial microstructure was observed by SEM and EDS. The results show that the interfacial microstructure is composed of two parts. The interaction layer I and II is made up of TiN and Ti-Si compound, respectively. The maximum bonding strength is 284.6 MPa with the brazing process of 1100℃ for 10 min. Under the same brazing condition, the bonding strength brazed with amorphous filler metal increases compared with the crystalline.

关 键 词：Cu-Ni-Ti 非晶钎料 SI3N4陶瓷 界面结构 连接强度 

分 类 号：TG454[金属学及工艺—焊接] TG425