SOP集成技术的发展现状及其在毫米波系统中的应用  

Progress of SOP Integration Technology and its Application in Millimeter-wave Systems

作　　者：朱勇[1] 张凯[1] 

机构地区：[1]中国西南电子技术研究所,成都610036

出　　处：《电讯技术》2013年第2期219-224,共6页Telecommunication Engineering

摘　　要：介绍了SOP(SystemOnPackage)集成技术,并与传统系统集成方法以及SOC(SystemOnChip)、MIP(ModuleInPackage)、MCM(Multi ChipModule)、SIP(SystemInPackage)等微封装、微集成技术进行了比较和分析,揭示了SOP小型化、低成本、高可靠性、高性能特点。对SOP在毫米波系统应用、新材料和新工艺的进展进行了总结,结果表明SOP在毫米波系统中具有良好的应用前景。In this paper, System-On-Package（SOP） is introduced. SOP is compared with traditional system integration technology and other types of integration technology, such as System-On-Chip（SOC）, Module-In-Package （MIP）, Multi-Chip-Module（MCM） and System-In-Package（SIP）. On this base, it is illustrated that SOP is featured by miniaturization, low cost, high reliability and high performance. And the progress of SOP in millimeterwave system application, new material and new manufacture technology is analyzed. The results show that SOP has promising future in millimeter-wave systems.

关 键 词：毫米波 集成技术 SOP 小型化 综述 

分 类 号：TN40[电子电信—微电子学与固体电子学] TN609