新型耐高温PI胶粘剂用单体的合成及表征  

Synthesis and characterization of monomer for new type polyimide adhesive with high temperature-resistance

作　　者：宋育杰[1] 陈功[1] 

机构地区：[1]北京航空航天大学材料科学与工程学院,北京100191

出　　处：《中国胶粘剂》2013年第2期13-17,共5页China Adhesives

摘　　要：为了提高聚酰亚胺(PI)胶粘剂的耐热性能,将碳硼烷引入PI分子链中,首次合成出一种新型含碳硼烷的PI单体,并采用红外光谱(FT-IR)法对其结构进行了表征。结果表明:含碳硼烷的PI单体在400～500℃升温过程中可交联固化;以此作为PI胶粘剂的基体,可赋予PI胶粘剂极佳的热稳定性能(500～1 300℃时热失重变化不大),从而为制备耐高温胶粘剂提供了新的途径和新的方法。In order to improve the heat-resistance of polyimide （PI） adhesive, a new type PI monomer with carborane was first synthesized by the carborane introduced into PI molecular chain,and its structure was characterized by infrared spectroscopy（FT-IR）. The results showed that the PI monomer with carborane could becured by crosslinking in heating process of 400-500 ℃. When it was used as a matrix of PI adhesive,the PI adhesive had excellent thermal stability （slightly change in hot weight-loss at 500-1 300 ℃）. Thereby,a new route and new method for preparin adhesives with high temperature-resistance were offered.

关 键 词：碳硼烷 耐高温 聚酰亚胺 胶粘剂 

分 类 号：TQ433.439[化学工程]