半导体制冷应用于新型膜组件冷腔的试验研究  

Experimental investigations of semiconductor refrigeration applied to new model membrane component cooling cavity

作　　者：尹秀翠[1] 邢世录[1] 杨晓宏[1] 杨胜男[1] 田瑞[1,2] 

机构地区：[1]内蒙古工业大学能源与动力工程学院,呼和浩特010051 [2]内蒙古可再生能源重点实验室,呼和浩特010051

出　　处：《低温工程》2013年第1期23-26,33,共5页Cryogenics

基　　金：国家自然科学基金资助项目(51266007);内蒙古自然科学(重大)基金(2010ZD09)资助

摘　　要：以新型气隙式膜蒸馏冷腔为研究对象,拟寻求合适的制冷源来代替大型、高耗能的制冷机。实验采用大空间空气强制对流散冷和循环水浴散热的方式,测试分析在特定条件下半导体冷端温度的变化规律,探求适合于空气隙膜蒸馏冷腔的片数及运行工况。研究结果表明,散热循环水浴流量和温度对半导体冷端的温度影响很大,环境温度的变化对半导体冷端温度也有一定的影响。同时并且适合于长时间运行,制冷迅速,稳定性好。在风机风量每小时60立方米,室温24℃,散热循环水浴流量每小时700升,温度20℃的条件下,半导体冷端温度是9.7℃,可以达到膜蒸馏冷腔所需的温度条件。可以作为优化气新型隙式膜组件冷腔的首选方案。Based on the new air gap membrane distillation cooling cavity, it is explored to seeking a suitable refrigeration source instead of large, high energy consumption of the refrigerating machine. Using a large space air forced convection cold dispersion and circulator bath cooling way, semiconductor cold end temperature variation was tested on specific conditions, semiconductor number and operation conditions of air gap membrane distillation cooling cavity were probed. The results showed that cooling circulating water flow rate and temperature changes played an important role on changing the semiconductor cold end temper- ature. Besides the change of environment temperature also effected the semiconductor cold end temperature partly. At the same time, the preferred scheme of optimization air gap new membrane component cooling cavity suitable for long time operation, rapid cooling, good stability was also determined. The semiconductor cold end temperature is 9.7 ℃ on condition that the fan air volume is 600 cubic meters per hour, the room temperature is 24 ℃ , the cooling circulating water flow is 700 liters per hours, the temperature is 20 ℃. Meanwhile, this scheme is suitable for distillation temperature.

关 键 词：空气隙膜蒸馏 半导体制冷 冷端温度散热循环水浴 膜冷腔 

分 类 号：TB69[一般工业技术—制冷工程] TB61