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机构地区:[1]广东水利电力职业技术学院机械工程系,广州510925
出 处:《低温工程》2013年第1期60-64,共5页Cryogenics
基 金:国家自然科学基金项目(50930005);广东省自然科学基金项目(U0834002)
摘 要:针对高性能电子芯片散热存在的问题,研制了一种复合毛细芯热柱,设计了复合毛细芯热柱的结构及其毛细芯结构,研究了不同参数对复合毛细芯热柱的传热性能的影响。结果表明复合毛细芯热柱在3 s内达到了恒定温度,启动性能非常好;热柱的最大传热量为140 W,传热性能随热柱倾斜角度的增加而降低;随着铜纤维直径的增加而降低。铜纤维烧结层厚度过大过小对热柱的传热性能都不利,只有适中的铜纤维烧结层厚度,热柱的传热性能最好。Composite wick heat column applied in dissipating high flux of microelectronic chip was de- veloped and its structure were designed. The influence of different parameter on its heat transfer perform- ance was investigated in test. The result shows that the composite wick heat column reached invariable tem- perature in 3s, which indicated it had good start-up performance. The composite wick heat column's maxi- mum heat transfer quantity is 140 W, the heat transfer performance decreases as the inclined angle increas- ing and increases as copper fiber diameter decreases. It is disadvantage for the heat transfer performance when the copper fiber sintering layer' s thickness is too large or little. Only when copper fiber diameter is moderate, it' s heat transfer performance is the best.
分 类 号:TB61[一般工业技术—制冷工程] TB69
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