与蒸发冷却相结合的半导体制冷装置性能分析  

The discuss of the performance of semiconductor refrigeration along with evaporative cooling

作　　者：孙哲[1] 黄翔[1] 范坤[1] 汪超[1] 孙铁柱[1] 

机构地区：[1]西安工程大学环境与化学工程学院,陕西西安710048

出　　处：《西安工程大学学报》2013年第1期88-92,共5页Journal of Xi’an Polytechnic University

基　　金：陕西省科技统筹创新工程计划项目(2011KTCQ01-10)

摘　　要：研究一种蒸发冷却与半导体制冷相结合的空调系统.按照测量冷热端进出水温度,推导公式计算的方法,得出了其不同工况下半导体制冷装置的制冷系数、制冷功率与电流的关系.实验结果表明,该半导体制冷片的最佳工作电流为3至4A,此时制冷系数最高可达4.2,得出了串联工况下略优于并联工况,水流量大略优于水流量小的结论.四组该半导体制冷装置与蒸发冷却设备相结合即可满足20m2空调区域的需求.An air-conditioning system tion is put forward. Inlet and outlet which combines evaporative cooling water temperature is measured, and with semiconductor refrigera- formula is derived. The rela- tionship of semiconductor refrigerating device between COP, refrigeration power and current is obtained under different conditions. The experimental results show that the best operating current of the semi- conductor refrigerating piece is 3 to 4A. At this time, the refrigeration coefficient can be as high as 4. 2. It is obtained that series conditions is slightly better than the parallel conditions, the higher volume of water is slightly better than the lower one. Four groups of semiconductor refrigerating device which is combined with evaporative cooling equipment can meet the needs of 20 m2 air-conditioning area.

关 键 词：蒸发冷却 半导体制冷 半导体制冷性能 匹配关系 

分 类 号：TU831.4[建筑科学—供热、供燃气、通风及空调工程]