PTCR元件化学镀镍电极的最优工艺条件  

The optimum electroless plating technology for nickel electrode of PTCR component.

作　　者：龚树萍[1] 吕红英[1] 张道礼[1] 周东祥[1] 

机构地区：[1]华中科技大学电子科学与技术系,湖北武汉430074

出　　处：《电子元件与材料》2000年第6期15-16,共2页Electronic Components And Materials

摘　　要：采用正交试验法研究了络合剂浓度、镀液 pH值、施镀温度与时间对BaTiO3 陶瓷PTCR元件化学镀镍电极的影响 ,得到制备化学镀镍电极的最优工艺条件。重复试验证明 ,在该工艺条件下获得的以Ni镀层为底层电极的PTCR元件 ,其耐电压和耐工频电流冲击性能良好。Effects of complexing agents concentration, pH value, plating temperature and time on electroless plated nickel electrodes of BaTiO 3 based ceramics are researched by orthogonal test,through which the optimum technology for making nickel electrodes of high properties is acquired. The duplicate tests prove that the PTC magnet erasing components of thus acquired electrode possesses higher withstand voltage and capacity of AC over current. (5 refs.)

关 键 词：化学镀镍电极 耐电压 PTCR元件 热敏电阻 

分 类 号：TN373[电子电信—物理电子学]