对甲基苯胺改性双氰胺环氧固化剂的合成及性能  

Synthesis and Properties of Dicyandiamide Curing Agent Modified by p-Toluidine

作　　者：程秀莲[1] 李石[2] 霸书红[1] 周琦[3] 宋恩军[3] 

机构地区：[1]沈阳理工大学装备工程学院,辽宁沈阳110159 [2]雅达(沈阳)建筑新材料有限公司,辽宁沈阳110326 [3]沈阳理工大学环境与化学工程学院,辽宁沈阳110159

出　　处：《化学与粘合》2013年第1期8-11,共4页Chemistry and Adhesion

摘　　要：用对甲基苯胺对双氰胺进行改性,制备了一种新型的改性双氰胺固化剂,对合成条件进行了优化,并对其固化环氧树脂条件进行了研究。结果表明,对甲基苯胺改性双氰胺的较佳工艺条件为对甲苯胺和水的物质的量比定为1∶1.5,双氰胺和苯胺的物质的量比为1∶1,转速为一档,于90℃,反应3h,收率85%。通过测试涂层硬度来考察固化工艺与性能。作为环氧树脂固化剂单独使用时,固化温度为110℃,比双氰胺体系固化温度160℃降低了近50℃,对甲基苯胺改性双氰胺固化温度高于120℃时,涂膜硬度大于双氰胺固化温度为160℃时涂膜硬度。A novel curing agent, the dicyandiamide modified by p-toluidine was prepared. The optimum conditions and the curing properties were studied. The results showed that the better technological conditions were listed as follows： the molar ratio of p-toluidine to water was 1.1：5, the molar ratio of dicyandiamide to p-toluidine was 1：1, the rotational speed was the first gear, the reaction temperature and time was 90℃ and 3h respectively and the yield of dicyandiamide modified by p-toluidine was up to 85%. The effects of the ratio of curing agent to epoxy and temperature- time on the resin＇s hardness were investigated by testing the paint membrane＇s hardness with modified dicyandiamide. When the dicyandiamide modified by p-toluidine was used as epoxy resin curing agent, the curing temperature of the curing system of modified dicyandiamide was 110℃ which was 50℃ lower than that of the curing system of dicyandiamide, which is 160℃. With its curing temperature being higher than 120℃, the film＇ s hardness of the curing system cured by modified dicyandiamide, was higher than that of dicyandiamide which was cured at 160℃.

关 键 词：对甲基苯胺 双氰胺 环氧树脂 硬度 

分 类 号：TQ314.256[化学工程—高聚物工业]