酸性光亮镀铜液中过多氯离子的去除  

Removal of excessive chloride ions from bright acid copper electroplating bath

作　　者：袁诗璞 何永强 

机构地区：[1]成都市武侯区晋阳巷2号会所花园A3-02-202,四川成都610045 [2]成都市成华区保和天鹅电镀厂,四川成都610051

出　　处：《电镀与涂饰》2013年第3期17-21,共5页Electroplating & Finishing

摘　　要：讨论了现有公开去除硫酸盐光亮酸性镀铜液中过多Cl-的方法(如化学沉淀)的原理及存在问题。对另一些可能的方法(如用其他还原剂替代锌粉以及氧化法)进行了分析或试验。开发了一种二液型无毒高效除氯剂。对工业化生产如何避免Cl-过多积累提出了建议。The principle and existing problems of current well-known methods such as chemical precipitation for removal of excessive C1- ions from bright acid sulfate copper electroplating bath were discussed. Some possible methods such as replacement of zinc powder other with other reductants and oxidation method were analyzed o tested. A non-toxic and high-performance two-componen liquid chloride removing agent was developed. Some advices on how to prevent the accumulation of excessive C1- ions in industrialized production were presented.

关 键 词：光亮酸性镀铜 硫酸盐 氯离子 去除 化学沉淀 亚铜离子 氧化 还原 

分 类 号：TQ153.14[化学工程—电化学工业]