化学镀镍磷合金复合配位剂的研究  

Study on composite complexants used for electroless nickel-phosphorus alloy plating

作　　者：朱焱[1] 江茜[1] 张印[1] 李鹏[1] 

机构地区：[1]武汉理工大学化学工程学院,湖北武汉430070

出　　处：《电镀与涂饰》2013年第3期25-29,共5页Electroplating & Finishing

摘　　要：研究了乳酸、柠檬酸和硼酸3种配位剂在不同浓度及复配条件下对化学镀Ni-P镀速的影响,确定了复合配位剂的最佳复配量为乳酸10g/L、硼酸15g/L。测试了不同镀层的结合力,通过扫描电镜、X射线衍射和能谱分析了复配配位剂所得镀层的表面形貌、结构和组成。研究结果表明,配位剂对化学镀Ni-P合金镀液稳定性及镀速有较大影响,配位剂复配可改善镀层的表面形貌,提高镀层的厚度和结合力。The effects of three kinds of complexants i.e. lactic acid, citric acid, and boric acid with different concentrations and under composite complexing conditions on the speed of electroless Ni-P plating were studied. The optimal formulation of composite complexant was determined as follows： lactic acid 10 g/L and boric acid 15 g/L. The adhesion strengths of various deposits were tested. The surface morphology, structure, and composition of the deposit obtained using the composite complexant was examined by scanning electron microscopy, X-ray diffraction and energy-dispersive spectroscopy. The results showed that the complexants have great effect on bath stability and Ni-P alloy deposition rate. The composite complexant can improve the surface morphology, thickness, and adhesion of deposit.

关 键 词：镍磷合金 化学镀 配位剂 镀速 结合力 

分 类 号：TQ153.2[化学工程—电化学工业]