硫脲对低温碱性化学镀镍的影响  

Influence of Thiourea on Electroless Ni Plating in Alkaline Bath at Low Temperature

作　　者：肖发新[1,2] 任永鹏[1] 申晓妮[1] 

机构地区：[1]河南科技大学材料科学与工程学院,洛阳471003 [2]河南省有色金属材料科学与加工技术重点实验室,洛阳471003

出　　处：《腐蚀科学与防护技术》2013年第2期138-142,共5页Corrosion Science and Protection Technology

基　　金：国家自然科学基金(50904023);河南省教育厅自然科学研究基金(2010B450001);河南科技大学青年科学基金(2009QN0022)资助

摘　　要：研究了添加剂硫脲(TU)对低温碱性化学镀镍的镀速和镀层质量的影响。结果表明,随着硫脲加入量增大,化学镀镍速率先减小后增大,其适宜加入量为1 mg/L;硫脲对H+的还原具有抑制作用而对镀层组成影响很小。它的添加使镀层晶粒更为细致均匀,镀层更平滑,孔隙率更低;镀层以Ni为主并含少许Ni5P4,硫脲使Ni结晶峰得到增强。少量的硫脲会促进极化进而减缓镍的沉积,但加入量增加时,则增加去极化效应而加速镍的沉积。The influence of thiourea（TU） addition on the deposition rate and quality of coating was investigated for a low temperature alkaline electroless nickel plating process. The results show that the deposition rate firstly decreases and then increases with the increasing thiourea addition, while the suitable addition amount is 1 mg/L. Due to the thiourea addition, the grains of the coating are refined, and the coating becomes smooth and even, which may be ascribed to the inhibition of TU to the reduction of H＋. Thiourea has little influence on coating chemical composition. XRD results show that the coating consists of dominant Ni and a little NisP4. A small amount of thiourea may promote polarization, resulting in decline of plating rate, whereas depolarization occurs with the increasing addition, resulting in the rise of plating rate.

关 键 词：硫脲 化学镀镍 碱性镀液 低温 

分 类 号：TQ153.14[化学工程—电化学工业]