ORGANIC/INORGANIC HYBRID EPOXY NANOCOMPOSITES BASED ON OCTA(AMINOPHENYL)SILSESQUIOXANE  

作　　者：Hai-bo Fan 杨荣杰 Xiang-mei Li 

机构地区：[1]School of Materials Science & Engineering,Beijing Institute of Technology

出　　处：《Chinese Journal of Polymer Science》2013年第1期148-158,共11页高分子科学（英文版）

摘　　要：Octa（aminophenyl）silsesquioxane （OAPS） was used as the curing agent of diglycidyl ether of bisphenol-A （DGEBA） epoxy resin. A study on comparison of DGEBA/OAPS with DGEBA/4,4＇-diaminodiphenyl sulfone （DDS） epoxy resins was achieved. Differential scanning calorimetry was used to investigate the curing reaction and its kinetics, and the glass transition of DGEBA/OAPS. Thermogravimetric analysis was used to investigate thermal decomposition of the two kinds of epoxy resins. The reactions between amino groups and epoxy groups were investigated using Fourier transform infrared spectroscopy. Scanning electron microscopy was used to observe morphology of the two epoxy resins. The results indicated that OAPS had very good compatibility with DGEBA in molecular level, and could form a transparent DGEBA/OAPS resin. The curing reaction of the DGEBA/OAPS prepolymer could occur under low temperatures compared with DGEBA/DDS. The DGEBA/OAPS resin didn＇t exhibit glass transition, but the DGEBA/DDS did, which meant that the large cage structure of OAPS limited the motion of chains between the cross-linking points. Measurements of the contact angle indicated that the DGEBA/OAPS showed larger angles with water than the DGEBA/DDS resin. Thermogravimetric analysis indicated that the incorporation of OAPS into epoxy system resulted in low mass loss rate and high char yield, but its initial decomposition temperature seemed to be lowered.Octa（aminophenyl）silsesquioxane （OAPS） was used as the curing agent of diglycidyl ether of bisphenol-A （DGEBA） epoxy resin. A study on comparison of DGEBA/OAPS with DGEBA/4,4＇-diaminodiphenyl sulfone （DDS） epoxy resins was achieved. Differential scanning calorimetry was used to investigate the curing reaction and its kinetics, and the glass transition of DGEBA/OAPS. Thermogravimetric analysis was used to investigate thermal decomposition of the two kinds of epoxy resins. The reactions between amino groups and epoxy groups were investigated using Fourier transform infrared spectroscopy. Scanning electron microscopy was used to observe morphology of the two epoxy resins. The results indicated that OAPS had very good compatibility with DGEBA in molecular level, and could form a transparent DGEBA/OAPS resin. The curing reaction of the DGEBA/OAPS prepolymer could occur under low temperatures compared with DGEBA/DDS. The DGEBA/OAPS resin didn＇t exhibit glass transition, but the DGEBA/DDS did, which meant that the large cage structure of OAPS limited the motion of chains between the cross-linking points. Measurements of the contact angle indicated that the DGEBA/OAPS showed larger angles with water than the DGEBA/DDS resin. Thermogravimetric analysis indicated that the incorporation of OAPS into epoxy system resulted in low mass loss rate and high char yield, but its initial decomposition temperature seemed to be lowered.

关 键 词：Organic-inorganic hybrid composites NANOSTRUCTURES Epoxy resin SILSESQUIOXANE Curing kinetics. 

分 类 号：TB30[一般工业技术—材料科学与工程]