恒速拉伸过程中纯 Cu 晶界内耗峰的变化  

CHANGES OF GRAIN BOUNDARY INTERNAL FRICTION PEAK OF PURE COPPER IN THE COURSE OF CONSTANT RATE TENSILE DEFORMATION

作　　者：戴勇[1] 刘少民[1] 孔庆平 

机构地区：[1]中国科学院固体物理研究所

出　　处：《材料科学进展》1991年第1期1-5,共5页

摘　　要：研究了纯 Cu 晶界内耗峰和模量弛豫在不同温度下恒速拉伸形变过程中的变化。考查了以下四种晶界弛豫参量的变化:(a)峰温,(b)峰高,(c)激活能,(d)模量弛豫强度。所得结果表明:在形变过程中晶界强度是变化着的,并且这种变化与断裂类型有密切关系。本文进一步肯定并扩展了我们以前在蠕变方面的工作。The changes of grain boundary internal friction peak and the correspondingmodulus relaxation of pure copper have been investigated in the couse of constant rate ten-sile deformation at different temperatures.The following four relaxation parameters:(a)the peak temperature,(b)the peak height,(c)the activation energy,and(d)the modulus re-laxation strength are investigated.Experimental results show that the strength of grainboundaries changes during deformation,and the extent of strengthening is closely corre-lated to the type of fracture.The present work supports and extends the conclusions of ourprevious works on the process of creep fracture.

关 键 词：晶界 内耗 CU 形变 蠕变 

分 类 号：TG146.11[一般工业技术—材料科学与工程]