钨纤维的排布方式对钨纤维增强铜基复合材料密度和导电性的影响  

Effects of Fiber Distribution on Density and Electrical Conductivity of Tungsten Fiber Reinforced Cu-Based Composite Material

作　　者：李锐[1] 陈文革[1] 王蕾[1] 

机构地区：[1]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《稀有金属》2013年第2期243-248,共6页Chinese Journal of Rare Metals

基　　金：陕西省教育厅自然科学基金项目(11JK0813)资助

摘　　要：采用预埋钨纤维、真空熔铸法制备钨纤维增强铜基复合材料,研究不同钨纤维排布方式对该复合材料密度、导电率等物理性能的影响。研究结果表明:采用直径为0.3 mm的钨丝,编织成相互平行、螺旋旋涡和网状等成型方式预埋于特制的高密、高强和高导的石墨模具中,在1150℃,真空度4×10-2Pa条件下,保温熔铸1～2 h纯铜可以制得钨纤维以所设计的排布方式均匀地分布在铜基体中,无明显偏聚现象,且纤维含量不大于5%的钨纤维增强铜基复合材料。增强相钨纤维与基体铜除极少量的扩散外互不反应也不溶解,两者界面清晰、无孔洞和开裂现象,所得复合材料致密度较高,3种排布方式的相对密度均不小于97%;当钨纤维含量相同时,不同钨纤维排布方式对钨纤维增强铜基复合材料的导电率影响较大,其中单向平行排布方式的导电率最大(94.40%IACS),空间螺旋网状排布导电率最低(85.62%IACS)。The fiber-reinforced Cu-based composite material of different tungsten fiber distribution was prepared by embedded tung- sten fiber and vacuum casting method. And the density and electrical conductivity of tile tungsten fibre-reinforced Cu-based composite material were investigated. The results showed that the tungsten fibers of 0.3 mm diameter was woven together with parallel, vortex and space spiral mesh distribution patterns, which were embedded in a special high-density, high-strength and high-conductivity graphitic mold. The non-segregation and content less than 5% uniform distribution fiber as well as with clear interface between the reinforced phase and Cu matrix of fiber-reinforced Cu-based composite material was fabricated by stay warm 1 - 2 h in 1150 ℃ and the vacuum degree of 4 × 10-2 Pa. All composite materials entirely had a relatively high density of more than 97%. With the same fiber content, the parallel-pattern material had the highest electrical conductivity of nearly 94.40%IACS, while the electrical conductivity of the spi- ral-pattern material was 85.62% IACS.

关 键 词：钨纤维 铜基复合材料 真空熔铸 物理性能 

分 类 号：TB331[一般工业技术—材料科学与工程]