SOT23(18排)电子封装模具技术推演  

SOT23(18R) electronic packaging mould technology deduction

作　　者：汪宗华 花富春 曾波 黄银青 田征 

机构地区：[1]安徽铜陵三佳山田科技有限公司技术开发部,安徽铜陵244000

出　　处：《模具技术》2013年第2期23-26,36,共5页Die and Mould Technology

摘　　要：介绍了SOT23电子封装模具市场、推演背景和各种结构模具产能比较,分析了SOT23(18排)电子封装模具技术推演设计,并针对模具设计难点,指出SOT23(18排)电子封装模具技术推演历程,应从模具流道、浇口设计,料筒、模盒排布,型腔支撑柱排布,引线、产品排布设计紧凑等各方面系统优化解决,确保塑封产品质量稳定。该设计大大提高了生产效率,创造了良好经济效益。Mould marketing, deduction background and productivity comparison between different mould structures in SOT23 electronic packaging was introduced and SOT23 （18rows） electronic packaging mould technology deduction and design was analyzed. Ac- cording to the difficulties in mould design, it was pointed out that SOT23（18rows） electronic packaging mould technology deduction should be solved by system optimization in aspects of mould runner and gate design, charging barrel and mould box configuration, cavity pillar configuration and leads and products compact configuration design. Thus, quality of plastic packaging can be ensured. This design improve production efficiency greatly and creat a good economic benefit.

关 键 词：封装模具 技术推演 流道浇口 产品排布 

分 类 号：TG241[金属学及工艺—铸造]