纯铜化学镀Ni-Cu-P工艺的研究  

A Study of Electroless Ni-Cu-P Plating on Pure Copper

作　　者：陈益兵[1] 赵芳霞[1] 张振忠[1] 孙晓东[1] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《电镀与环保》2013年第2期36-38,共3页Electroplating & Pollution Control

摘　　要：针对纯铜使用过程中表面腐蚀及导电性需进一步提高等问题,采用化学镀Ni-Cu-P对纯铜进行表面改性。采用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、界面接触电阻测试、极化曲线等手段,研究了化学镀Ni-Cu-P工艺对纯铜性能的影响。结果表明:该工艺能得到典型的非晶胞状结构,改性后纯铜的接触电阻为改性前的15%～30%,自腐蚀电流密度降低两个数量级。Aiming at the problems of corrosion and boundary conductivity to be improved when pure copper is in the process of application, the surface of pure copper was modified by electroless Ni-Cu P plating. The effects of electroless Ni-Cu-P plating process on the properties of pure copper were investigated by means of XRD, SEM, contact resistance test, corrosion test, etc. The results show that the process can obtain a typical amorphous cellular structure, the contact resistance of modified pure copper is 15 %- 30 % of that before modification, and the self-corrosion current density is decreased by two orders of magnitude.

关 键 词：化学镀 NI-CU-P 界面导电性能 耐蚀性 

分 类 号：TQ153[化学工程—电化学工业]