微流控芯片基片与盖片一体化注塑成型研究  

Research on incorporate injection molding of the cover sheet and the substrate sheet for microfluidic chip

作　　者：宋满仓[1] 刘莹[1] 祝铁丽[1] 杜立群[2] 王敏杰[1] 刘冲[2] 

机构地区：[1]大连理工大学模塑制品教育部工程研究中心,大连116023 [2]大连理工大学微纳米技术及系统辽宁省重点实验室,大连116023

出　　处：《材料科学与工艺》2013年第1期13-17,共5页Materials Science and Technology

基　　金：国家自然科学基金重大项目资助(20890024);国家重点基础研究发展计划资助项目(2007CB714502)

摘　　要：针对微流控芯片基片与盖片的结构特点,提出了定模先行抽芯机构,设计制造了微流控芯片基片与盖片一体化注塑成型模具,并进行注塑成型试验研究.结果表明:定模先行抽芯机构可以有效解决盖片上圆孔状储液池成型与脱模的技术难题,如何使微通道复制完全是微流控芯片基片注塑成型的主要技术难点;模具温度对提高微通道复制度起决定性作用,注射速度和熔体温度是次要因素,而注射压力相对其他因素影响力较差,但必须保持在一个较高的水平,依此形成塑料微流控芯片的注塑成型工艺规范.In accordance with the structural features of the cover sheet and substrate sheet for microfluidic chip,a kind of core-pulling mechanism in stationary mold which could be worked before the mold opening was proposed,an injection mold for the incorporate forming of the cover sheet and substrate sheet for microfluidic chip was designed and manufactured,and molding tests were carried out.The results show that the problem to mold and eject the round hole for liquid storage in cover sheets can be solved by use of this kind of mechanism,and the incomplete replication of the microchannels in the substrate sheets is the main technical difficulty to the molding.The mold temperature is the decisive parameter to the replication fidelity of the microchannels,injection rate and melt temperature are the secondary factors,injection pressure is less important than the others,but higher injection pressure is necessary.

关 键 词：微通道 微流控芯片 注塑成型 复制度 基片 盖片 

分 类 号：TQ320[化学工程—合成树脂塑料工业]