电气石/硅藻土基内墙砖釉层热处理温度对其结构与性能的影响  

Influence of Heat Treatment Temperature on Structure and Performance of Tourmaline/Diatomite Wall Tile′ Enamel Layer

作　　者：高如琴[1] 黄豆豆[1] 郑水林[2] 

机构地区：[1]华北水利水电学院环境与市政工程学院,郑州450011 [2]中国矿业大学化学与环境工程学院,北京100083

出　　处：《硅酸盐学报》2013年第4期534-539,共6页Journal of The Chinese Ceramic Society

基　　金：国家"十二五"科技支撑计划(2011BAB03B07);河南省教育厅自然科学研究计划项目(2011B610005)资助

摘　　要：采用固相烧结和低温煅烧工艺,制备了硅藻土基多孔陶瓷支承体。以硅藻土为主要原料,在釉料里添加适量电气石和烧结助剂,结合不同的釉层热处理温度,制备了电气石/硅藻土基内墙砖。用热重–差示扫描量热分析、X射线衍射、扫描电子显微镜对不同热处理温度下釉层进行了表征,探讨了热处理温度对釉层微观形貌与结构的影响。以甲醛为目标降解物,考察了釉层不同热处理温度下电气石/硅藻土基内墙砖对甲醛去除效果的影响。结果表明:随着热处理温度的提高,硅藻土原始孔洞减少,比表面积和孔隙率下降,电气石结构发生变化。850℃时材料的表面结构稍有破坏,强度较高,对甲醛的去除效果较好,1 m3的环境舱内,300 min甲醛去除率达到73.6%;升温至950℃及以上,硅藻土和电气石结构遭到破坏,材料对甲醛的吸附和降解能力下降。A supporting body of diatomite-based porous ceramic was prepared by a solid-phase sintering process and a low-temperature calcination process. Tourmaline/diatomite wall tile′ enamel layer was prepared with diatomite as main materials and proper tourmaline and binding agent addition by enamel layer heat treated at different temperatures. The materials obtained were characterized by thermogravimetry-differential scanning thermal analysis, X-ray diffraction, scanning electron microscope and Fourier transform infrared, respectively. The influence of heat treatment temperature on the surface groups, structure and performance of materials was investigated, and the removal efficiency of materials to formaldehyde was analyzed. The results indicate that diatomite original holes reduce and tourmaline structure also changes with the increase of heat treatment temperature. The surface structure of materials was slightly damaged. The removal rate of materials with the high strength and superior removal efficiencies to formaldehyde at 850℃ reached 73.6% in an environmental chamber of 1 m^3 for 300 min. The structure of diatomite and tourmaline was destroyed, and the ability of materials adsorption and degradation to formaldehyde decreased as heated at≥ 950℃.

关 键 词：硅藻土基多孔陶瓷 电气石 硅藻土基内墙砖 釉层 热处理温度 甲醛 吸附与降解 

分 类 号：TB332[一般工业技术—材料科学与工程]