铜合金/纯铜同基合金电弧离子镀技术的研究  

The Reviewing and Prospect of the Research on Copper Alloy/Cu Ion Plating

作　　者：侯文义[1] 郝俊丽[2] 

机构地区：[1]太原理工大学机械工程学院,山西太原030024 [2]晋中职业技术学院煤炭化工系,山西晋中030600

出　　处：《机械管理开发》2012年第3期24-25,27,共3页Mechanical Management and Development

摘　　要：同基合金离子镀是近年来开发的一项离子热处理新技术,综合了在铜合金/纯铜同基合金离子镀所作的研究,分别对镀层组织、镀层成分、显微硬度和沉积速率进行了讨论。结果表明,青铜/纯铜离子沉积层组织由片层状薄片构成;过渡层的存在使镀层与基材具有令人满意的结合强度。The technique of the ion plating on the same basic components is one of the new heat treatment techniques. This paper makes a sur- vey about the recent developent of the new deposition techniques for different copper alloy film coatings, such as the microstructure, composi- tion of layer, micro-hardness, deposited rate and so on. It is showed that the films are composed of the form of laminate; and the presence of the transition layer in favor of advancing the integrating of the film and the substrate.

关 键 词：同基合金 离子镀 镀层组织 显微硬度 

分 类 号：TG174.444[金属学及工艺—金属表面处理]