IGBT模块封装的热性能分析  

Thermal Performance Analysis of IGBT Module Packaging

作　　者：丁杰 唐玉兔 忻力 张陈林 胡昌发 

机构地区：[1]南车电气技术与材料工程研究院,湖南株洲412001

出　　处：《机车电传动》2013年第2期9-12,34,共5页Electric Drive for Locomotives

摘　　要：利用ANSYS有限元分析软件建立了IGBT模块封装的有限元模型,分析了导热硅脂厚度、当量换热系数、基板厚度和材料、焊料厚度和材料、衬板厚度和材料、铜层厚度等因素对IGBT模块封装热性能的影响,并探讨了热扩展对芯片结温的影响。研究结果可为优化IGBT模块封装提供参考。A finite element model of IGBT module packaging was constructed by utilizing FEA software of ANSYS. Effect of different grease thickness, equivalent heat transfer coefficient, base plate thickness and material, solder thickness and material, substrate thickness and material, copper layer thickness on thermal performance of IGBT module packaging were studied, as well as chip junction temperature affected by thermal spreading. The obtained conclusions might help to optimize packaging design of IGBT module.

关 键 词：IGBT模块 热性能 热扩展 热传导 当量换热系数 有限元分析 

分 类 号：TN34[电子电信—物理电子学]