毫米波300W固态功率合成放大器的设计  

Design of a 300 W Millimeter-wave Solid-state Power Combining Amplifier

作　　者：王斌[1] 王义[1] 

机构地区：[1]中国电子科技集团公司第五十四研究所,河北石家庄050081

出　　处：《无线电工程》2013年第4期44-47,共4页Radio Engineering

摘　　要：基于单片微波集成功率放大器(Monolithic Microwave Integrated Circuits,MMIC PA)的毫米波波导空间功率合成技术是固态毫米波高功率电子领域的热门研究方向。多合成支路情况,保持较高的合成效率和较宽的工作带宽是实现固态毫米波宽带高功率合成的关键技术难题。为提高功率合成效率,研制了石英基板微带探针与波导之间的过渡结构。结合波导T型分支、波导分支线、波导H面缝隙耦合和波导一分四型的4种波导功率分配/合成器,通过精确的电磁仿真研制了64路功率合成放大器。A millimeter-wave waveguide-based spatial power combining technique using MMIC power amplifiers （Monolithic Microwave Integrated Circuit）is currently the focus of in millimeter-wave solid-state high power electronic field. Under a large number of combining ways, the realization of millimeter-wave broadband solid-state high power combining has been cumbered by problems about maintaining a high efficiency and a broad bandwidth. To raise the power combining efficiency,a waveguide-to-microstrip built on quartz was developed. With an E-T waveguide power divider/combiner,a branched-waveguide coupling power divider/ combiner, a waveguide H Blind side coupling power divider/combiner, and a l-to-4 waveguide power divider/ combiner, a 64-way power combining network and a 64-way power combining amplifier were designed in HFSS.

关 键 词：KA频段 波导—微带过渡 功率分配 合成器 功率合成放大器 强制风冷 

分 类 号：TN73[电子电信—电路与系统]