pH对锡-银-铜三元合金共沉积的影响  

Effect of pH on codeposition of tin-silver-copper ternary alloy

作　　者：张莹莹[1] 石秀敏[1] 高学朋[1] 贺岩峰[1] 

机构地区：[1]长春工业大学化学工程学院,吉林长春130012

出　　处：《电镀与涂饰》2013年第4期5-8,共4页Electroplating & Finishing

基　　金：吉林省自然科学基金(20101532)

摘　　要：以HEDTA(N-β-羟乙基乙二胺三乙酸)为主配位剂,通过极化曲线测量、电感耦合等离子体发射光谱、表面形貌分析和X射线衍射谱分析等研究了pH对Sn-Ag-Cu三元合金共沉积的影响。镀液组成及工艺参数为:Sn(CH3SO3)2110g/L,Ag2O0.0811g/L,Cu(CH3SO3)20.876g/L,HEDTA278.3g/L,硫脲4.6g/L,烷基糖苷1g/L,温度25°C,电流密度10mA/cm2。结果表明,随pH增大,Sn-Ag-Cu的沉积电位负移。pH为3.22～7.74时,Sn-Ag-Cu合金镀层结晶细致、表面平整。Sn-Ag-Cu合金镀层由Sn、Ag3Sn和Cu6Sn5组成,其结晶取向随pH改变而变。HEDTA体系电沉积Sn-Ag-Cu合金镀层的适宜pH为3.00～6.00,最优范围是5.00～6.00。The effect of pH on codeposition of Sn-Ag-Cu ternary alloy was studied by polarization curve measurement, inductively coupled plasma emission spectroscopy, surface morphology analysis, and X-ray diffraction spectroscopy, using HEDTA [N-（β-hydroxyethyl）ethylenediamine triacetic acid] as main complexing agent. The bath composition and process parameters are as follows： Sn（CH3SO3）2 110 g/L, Ag20 0.081 1 g/L, Cu（CH3SO3）2 0.876 g/L, HEDTA 278.3 g/L, thiourea 4.6 g/L, alkyl glycosides 1 g/L, temperature 25 ℃, and current density 10 mA/cm2. The results show that the deposition potential shifts towards negative as the pH increases. The Sn-Ag-Cu alloy coatings obtained at 3.22-7.74 are fine-grained and level. The Sn-Ag-Cu alloy coating is composed of Sn, Ag3Sn and Cu6Sn5. The crystal orientation of the coating changes as pH changes. The suitable pH for electrodeposition of Sn-Ag-Cu alloy coating from HEDTA system is 3.00-6.00, and the optimal pH is 5.00-6.00.

关 键 词：锡-银-铜合金 电沉积 PH N-β-羟乙基乙二胺三乙 酸 

分 类 号：TQ153.2[化学工程—电化学工业]