Al/Sn二元扩散偶相界面扩散溶解层的形成机理  

Forming mechanism of diffusion couple of Al/Sn interphase diffusion solution layer

作　　者：马会宇[1] 竺培显[1] 周生刚[1] 韩朝辉[1] 

机构地区：[1]昆明理工大学材料科学与工程学院,昆明650093

出　　处：《中国有色金属学报》2013年第3期816-821,共6页The Chinese Journal of Nonferrous Metals

基　　金：国家高技术研究发展计划资助项目(2009AA03Z512);国家自然科学基金资助项目(51074082)

摘　　要：采用层片式扩散偶制备技术制备Al/Sn扩散偶,在不同热压温度条件下进行热处理,利用金相显微镜、扫描电镜、能谱仪、XRD衍射仪等研究Al/Sn扩散偶扩散溶解层的形貌特征与形成机理。结果表明:在0.5 MPa和230℃烧结条件下,Sn元素优先沿Al晶界扩散,然后沿其表面扩散;随着扩散时间的延长,Al与Sn元素间扩散和溶解程度增大,界面区无新物相生成,最终形成由Al和Sn的离异合金组织组成的界面过渡层且呈锯齿状形态分布;Al/Sn界面冶金结合是Al和Sn固相扩散、溶解与结晶共同作用的结果。The diffusion couples of A1/Sn were prepared by laminating diffusion couple technology, and then treated for different holding times. The appearance characteristics and forming mechanism of Al/Sn diffusion solution layer were investigated by the metallographic microscope, SEM, EDS and X-ray diffractometry. The results show that, under sintering conditions of 230℃ and 0.5 MPa, Sn element spreads along A1 grain boundary preferentially, and then spreads along A1 substrate. With the increase of the diffusion time, there exist strong elemental diffusion and dissolution between Sn and A1. Finally, there are no new phases formed at the interface. The interface transition layer, which is in the sawteeth shape, consists of A1 and Sn divorced alloy. The formation of metallurgical bonding interface comes from the solid phase diffusion, dissolution and crystallization between A1 and Sn.

关 键 词：AL SN 扩散偶 界面 扩散溶解层 形成机理 

分 类 号：TG406[金属学及工艺—焊接]