一种具有优异介电性能的高Tg无卤型覆铜板的介绍  

The introduction of a high Tg halogen-free CCL with good dielectric properties

作　　者：粟俊华 席奎东 况小军 

机构地区：[1]上海南亚覆铜箔板有限公司

出　　处：《印制电路信息》2013年第4期65-71,共7页Printed Circuit Information

摘　　要：信息产业飞速发展,覆铜板应用领域对板材的介电性能越来越关注,在对覆铜板性能要求越来越高的时候,又不能忽视当下世界对环保的重视,具有较低介电性能的无卤型覆铜板无疑是最佳的开发之选。文章主要介绍了以改性环氧树脂,结合苯并噁嗪树脂进行固化,得到的一种具有优异介电性能的高Tg无卤型覆铜板。With the rapid development of the information industry, the copper clad laminate application fields pay more and more attention to dielectric performance on sheet. With the increasingly high performance requirements today, we also cannot ignore the present world attention to environmental protection. Undoubtedly, the low dielectric properties of halogen free copper clad panel is the best development choice to meet these requirements. This paper mainly introduces the method of getting a high Tg Halogen-free CCL with good dielectric properties type conner clad laminate. We mainly solidify the modified enoxv resins combined with benzene resins.

关 键 词：苯并噁嗪 无卤 低介电 

分 类 号：TN41[电子电信—微电子学与固体电子学]