HDI板埋孔塞孔新工艺及成本优势研究  

Research on technology of filling HDI buried holes and advantage of cost accounting

作　　者：白亚旭 何淼 彭卫红 欧植夫 

机构地区：[1]深圳崇达多层线路板有限公司,广东深圳518132

出　　处：《印制电路信息》2013年第4期197-202,共6页Printed Circuit Information

基　　金：广东省教育部产学研结合项目(2011B090400630)专项资金资助

摘　　要：文章主要介绍了一种HDI板埋孔压合塞孔新的工艺方法,以及此方法的成本优势。本方法的主要原理是:压合时使用一种高含胶量、高流动性的半固化片根据树脂流动性的特点对埋孔进行塞孔填充。通过实验研究,当板厚≤2.0mm、埋孔孔径≤0.3mm时,压合塞孔饱满良好、无空洞、无气泡。并将此方法的生产工艺流程与传统的树脂塞孔生产工艺流程进行对比,发现此方法的工艺流程更加简单优化,成本优势更好。The paper mainly present a new technology of filling HDI buried holes by laminating and its cost advantage of the new technology. The main principle of the method is to fill HDI buried holes according to fluidity of resin by means of using high resin content, high resin fluidity prepreg during lamination. When thickness of board is less than or equal to 2.0mm, diameter of buried holes is less than or equal to 0.3mm,there is no cavity and air bubble after lamination through experiment research. In addition, we compare this new manufacturing process with traditional manufacturing process of resin filling, finding that this new technology process is more simplified and optimized, the advantage of cost is better.

关 键 词：高密度互连板 埋孔 压合塞孔 半固化片 成本核算 

分 类 号：TN41[电子电信—微电子学与固体电子学]