Ni、Zn改性CuO/SiO_2催化剂的TPR-TPO循环表征  

TPR-TPO circle characterization of CuO/SiO_2 catalyst modified by nickel and zinc

作　　者：赵小贞[1] 陈慧[1] 

机构地区：[1]天津理工大学化学化工学院,天津300384

出　　处：《工业催化》2013年第3期39-44,共6页Industrial Catalysis

摘　　要：采用TPR-TPO循环表征和XRD对CuO/SiO2及Ni、Zn改性CuO/SiO2催化剂进行研究,结果表明,催化剂的第一次还原氧化循环与随后的循环不同。NiO与CuO相互作用,还原峰温降低;添加Zn使还原峰温延后,经过第一次还原氧化循环,组分在载体表面进行再次分布,还原温度明显降低。CuO/SiO2 catalyst and modified CuO/SiO2 catalyst by nickel and zinc were characterized by TPR-TPO circles and XRD. The results showed that the first TPR-TPO circle of the catalyst was different from the subsequent circles. The temperature of reduction peak was decreased due to the interaction betweennickel and copper oxides. Adding zinc caused the temperature enhancement. The components on the surface of the carrier were distributed again after first circle, and the reduction temperature decreased remarkably.

关 键 词：催化化学 TPR-TPO循环表征 还原氧化循环 CUO SIO2催化剂 

分 类 号：O643.36[理学—物理化学] TQ426.1[理学—化学]