缺陷表面温度场的红外无损检测分析  

Analysis of Temperature field on Near Surface Defect in Infrared Nondestructive Testing

作　　者：郑恩辉[1] 曹文浩[1] 富雅琼[1] 陈乐[1] 

机构地区：[1]中国计量学院,浙江杭州310018

出　　处：《计算机仿真》2013年第4期416-420,共5页Computer Simulation

基　　金：国家自然科学基金(60905034);浙江省自然科学基金(Y1080950)

摘　　要：关于复合材料表面缺陷无损检测优化问题,利用闪光灯激励脉冲热像法的红外无损检测,对近表面不同尺寸(大小、深度)的预埋缺陷进行检测与评价。通过实验与有限元软件ANSYS仿真,获取缺陷近表面温度场,根据对温度场中温度的均匀性分布,以及对温度场中温度特征值的提取,研究缺陷尺寸对温度场分布影响。在加热—冷却过程中,对温度场与最大温差曲线进行分析,实验与仿真结果表明:在不同阶段内,缺陷大小、深度对温度场影响不同;通过合理选取不同阶段并进行分析,可以对缺陷做出定性与半定量判断。In the paper, Infrared Flash Thermography, a method of infrared non - destructive testing, was ap- plied to detect and evaluate pre -buried defects of different dimension （size, depth） near surface. Temperature dis- tribution of defects near surface was obtained by experiment and simulation of finite element software ANSYS respec- tively, and temperature field and characteristic value of temperature were used to analyze influence of defect dimen- sion acting on temperature field. According to the analyses of temperature distribution and maximum temperature curve, the experiment and simulation results indicate that the sizes and depths of defects have different effects on the distribution of temperature field, and the defects can be evaluated by choosing different appropriate stages qualitative- ly and semi -quantitatively.

关 键 词：红外无损 缺陷尺寸 温度场 特征值 

分 类 号：N945.12[自然科学总论—系统科学]