片状导电填料对银碳浆方阻和流变性能的影响  

Effect of Flake Conductive Filler on the Square Resistance and Rheological Properties of Silver Carbon Paste

作　　者：肖爽[1] 堵永国[2] 刘其城[1] 王宏[3] 杨初[2] 

机构地区：[1]长沙理工大学物电学院,长沙410076 [2]国防科技大学航天科学与工程学院,长沙410073 [3]湖南有色中央研究院有限公司,长沙410073

出　　处：《涂料工业》2013年第5期1-5,共5页Paint & Coatings Industry

基　　金：湖南有色重大专项(2012BAE06B00)

摘　　要：在选定粘结剂体系的基础上,制备了不同片状银粉含量的银碳浆。分别测试了浆料固化膜的导电性能、浆料的黏度曲线、应变扫描曲线和频率扫描曲线,以表征分析片状银粉含量对银碳浆性能的影响。结果表明随片状银粉所占比例的增加膜层方阻呈指数递减;不同片银含量的银碳浆均表现出剪切变稀行为,随片状银粉所占比例的增加浆料在低剪切下的黏度降低;碳浆、银碳浆的线性黏弹区范围基本一致,但银碳浆流动点较碳浆小,流动性较好;银碳浆相对碳浆具有更好的贮存稳定性,印刷适性更佳。On the basis of the selected binder system, the conductive silver carbon paste with different contents of silver powder was prepared. To characterize the influence of flake sil- ver powder on the performance of silver carbon paste, the conductive properties, viscosity curve, strain sweep curve, frequency sweep curve of the paste were tested. It was found that the square resistance of conductive film decreased exponentially with the increase of content of flake silver powder. The silver carbon paste with different contents of flake silver powder exhibited a shear-thinning behavior. The viscosity of the paste at low shear was decreased with the in- crease in the proportion of silver powder. The linear viscoelastic range of the carbon paste was basically similar to the silver carbon paste. However, compared with carbon paste, the silver carbon paste showed a lower yield point and better flowability, storage stability and printability.

关 键 词：银碳浆 片状银粉 方阻 流变性能 

分 类 号：TQ632.2[化学工程—精细化工]