用于SPICE模拟高频互连效应的RLC电路模型  

An Equivalent RLC Circuit Model for SP ICE Simulation of Interconnect Effects in High Frequency

作　　者：宋任儒[1] 阮刚[1] 梁擎擎[1] 朱兆旻[1] 肖夏 ReinhardStreiter ThomasOtto ThomasGessner 

机构地区：[1]复旦大学电子工程系 [2]开姆尼兹技术大学微技术中心

出　　处：《微电子学》2000年第5期302-308,共7页Microelectronics

摘　　要：提出了一个用于 SPICE模拟高频互连效应的 RLC互连电路模型 ,该模型考虑了频率对互连电感、电阻的影响 ,适用于从芯片间互连到芯片内互连高频效应的分析。基于所提出的互连模型 ,对频率达 1 0 0 0 MHz时芯片内长互连线的延迟、串扰、过冲等互连寄生效应进行了分析 。WT5”BZ ]An equivalent RLC circuit model for analyzing propagation characteri stics of high frequency waves on interconnects is presented The model, in whi ch the effects of frequency on interconnect inductance and resistance have been considered, is available for analyzing both package level interconnect and on chip interconnect in the whole spectrum, by using the nodal electrical simulator SPICE Based on the model, the on chip interconnect effects,such as delay, crosstalk and overshoot,have been analyzed for an input pulse frequenc y of 1000 MHz, and techniques to suppress those interconnect effects have be en proposed

关 键 词：SPICE模拟 互连效应 PLC电路模型 集成电路 

分 类 号：TN402[电子电信—微电子学与固体电子学]