一类高聚物电子封装材料中的空穴问题  

The Cavity Problem in the Polymeric Electronic Packaging Material

作　　者：李志刚[1] 王慧明[1] 树学峰[1] 

机构地区：[1]太原理工大学应用力学与生物医学工程研究所,太原030024

出　　处：《材料导报》2013年第8期138-141,162,共5页Materials Reports

基　　金：国家自然科学基金(11172195);山西省自然科学基金(2012011019-4)

摘　　要：研究了补强后具有幂率强化特征的广义neo-Hookean的高聚物电子封装材料,利用超弹性材料空穴分叉的理论推导出了此类封装材料在回流焊过程中空穴的生成及增长与热应力之间的解析关系。同时考虑了高聚物电子封装材料添加补强纤维后对空穴增长模型产生的影响。讨论了补强系数γ和补强后的硬化指数n对空穴增长的影响。分析结果表明:对于补强后的电子封装材料,如果储能函数中的硬化指数为偶数形式,则空穴失稳的极限载荷将伴随着补强系数的增大而增大;反之,如果为奇数形式,则极限载荷将伴随着补强系数的增大而降低,具有这种储能形式的高聚物材料更易发生"爆米花"式的失效。The cavity formation in the generalized neo-Hookean polymeric packaging material with power rates strengthen feature after reinforcement is focused on, the cavity bifurcation theory in the hyperelastic material is used to demonstrate the analytic relationship between the generation and development of cavity in solder-reflow process for this specific packaging material and heat stress. The effects of rein（orcing fibers which is added into this material on the model of cavity development are taken into consideration. The influences of reinforce coefficient ）＇ and hardening coeffi- cient n after reinforcing on the cavity development are also discussed. The results show that for the electronic package material with reinforcement if the hardening coefficient in energy storage function is even, the limit load for cavity in- stability will increase with the reinforce coefficient. On the contrary, if the hardening coefficient is odd number, the limit load will decrease as the reinforce coefficient increase, material with this kind of energy storage feature. ＂popcorn＂ failure can occur more easily on the polymeric

关 键 词：neo—Hookean的高聚物材料 “爆米花”失效 空穴 

分 类 号：O344[理学—固体力学]