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机构地区:[1]南京邮电大学自动化学院
出 处:《电子技术(上海)》2013年第3期18-20,共3页Electronic Technology
摘 要:文章的目标是讨论影响非接触式供电系统中初、次级线圈耦合效率的几种因素。先介绍了基于PCB(Printed Circuit Board)的非接触供电系统的基本结构,然后提出了影响初、次级耦合效率的几种因素,在此基础上设计了几种仿真方案,在Is-Spice仿真环境下,对几种仿真方案进行了仿真,并给出了结果。The purpose of this paper is to discuss the impact factors affecting the coupling efficiency of the primary and secondary coils in the contactless power supply system. First, the basic structure of the contactless power supply system based on PCB (Printed Circuit Board) is introduced, and then several factors affecting primary and secondary coupling efficiency are proposed. On this basis several simulation schemes are designed, in Is-Spice simulation environment, several simulation schemes are simulated, and the results are given.
分 类 号:TN41[电子电信—微电子学与固体电子学]
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