Self-adaptive phosphor coating technology for wafer-level scale chip packaging  

Self-adaptive phosphor coating technology for wafer-level scale chip packaging

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作  者:周琳淞 饶海波 王伟 万贤龙 廖骏源 王雪梅 周炟 雷巧林 

机构地区:[1]School of Opto-Electronic Information,University of Electronic Science and Technology of China

出  处:《Journal of Semiconductors》2013年第5期96-99,共4页半导体学报(英文版)

基  金:supported by the Guangdong Province Scientific Research Program(Nos.2011B090400083,2011A081301019)

摘  要:A new self-adaptive phosphor coating technology has been successfully developed, which adopted a slurry method combined with a self-exposure process. A phosphor suspension in the water-soluble photoresist was applied and exposed to LED blue light itself and developed to form a conformal phosphor coating with self- adaptability to the angular distribution of intensity of blue light and better-performing spatial color uniformity. The self-adaptive phosphor coating technology had been successfully adopted in the wafer surface to realize a wafer- level scale phosphor conformal coating. The first-stage experiments show satisfying results and give an adequate demonstration of the flexibility of self-adaptive coating technology on application of WLSCP.A new self-adaptive phosphor coating technology has been successfully developed, which adopted a slurry method combined with a self-exposure process. A phosphor suspension in the water-soluble photoresist was applied and exposed to LED blue light itself and developed to form a conformal phosphor coating with self- adaptability to the angular distribution of intensity of blue light and better-performing spatial color uniformity. The self-adaptive phosphor coating technology had been successfully adopted in the wafer surface to realize a wafer- level scale phosphor conformal coating. The first-stage experiments show satisfying results and give an adequate demonstration of the flexibility of self-adaptive coating technology on application of WLSCP.

关 键 词:white light-emitting diodes self-adaptive conformal coating wafer level encapsulation technology multi-chip packaging 

分 类 号:TN312.8[电子电信—物理电子学]

 

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